Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshifumi Takada0
Date of Patent
February 5, 2008
Patent Application Number
11016156
Date Filed
December 17, 2004
Patent Primary Examiner
Patent abstract
In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.
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