Patent attributes
A wiring substrate section 2, which has a wiring substrate 20 with through holes 20c each filled with a conductive member 21 serving as a conduction path for guiding a detected signal, is installed between a radiation detecting section 1 comprised of a scintillator 10 and a PD array 15, and a signal processing element 30 for processing the detected signals outputted from the PD array 15. Each through hole 20c in the wiring substrate 20 is formed so that, with respect to a predetermined plane perpendicular to a conduction direction from an input surface 20a to an output surface 20b, an aperture of the through hole 20c in that plane is not on an extension along the conduction direction of an aperture of the through hole 20c in the input surface 20a and so that the through hole 20c cannot be seen through from the input surface 20a to the output surface 20b. This obtains the wiring substrate capable of suppressing transmission of radiation, and a radiation detector using it.
