Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 5, 2008
Patent Application Number
11022728
Date Filed
December 22, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit (IC) module has an IC die, a heat sink, a cooling fluid path and a fluid pump. The IC die, the heat sink and the fluid pump are mounted together. The fluid pump forces cooling fluid through the cooling fluid path to receive heat from the IC die and to transfer heat to the heat sink.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
