Patent attributes
A method for routing vias in a multilayer substrate is disclosed. One embodiment of a method may comprise providing a multilayer substrate with an internal bond surface having a plurality of internal bond pads and an external bond surface with a plurality of external bond pads. A plurality of power vias and ground vias may be routed from a first redistribution layer between the internal bond surface and the external bond surface to a second redistribution layer between the first redistribution layer and the external bond surface based on a via pattern. The via pattern may comprise routing a power via and a ground via adjacent one another spaced apart at a distance that is substantially equal to a minimum routing pitch associated with the multilayer substrate.
