Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bahram Afshari0
Guolin Ma0
Date of Patent
February 12, 2008
0Patent Application Number
106846190
Date Filed
October 14, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
