Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 12, 2008
Patent Application Number
11086126
Date Filed
March 21, 2005
Patent Primary Examiner
Patent abstract
Wafers or other structures comprising a plurality of dies or devices are tested at non-ambient temperatures by inducing a first heat flux through a substantial portion of a surface of the structure to modify a temperature of the structure and inducing a second heat flux through a local area of a surface of the structure, proximate the device under test, to modify the temperature the device under test.
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