US Patent 7332414 Chemical die singulation technique
Patent 7332414 was granted and assigned to Freescale Semiconductor on February, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 22, 2005
0
Date of Patent
February 19, 2008
0
Patent Application Number
11159553
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Patent Inventor Names
Brian W. Condie
0
David J. Dougherty
0
Mahesh K. Shah
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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