Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hajime Nakata0
Date of Patent
February 19, 2008
0Patent Application Number
112705870
Date Filed
November 10, 2005
0Patent Primary Examiner
Patent abstract
In a thermal head, a heating element array is formed in a head substrate. Both ends of the head substrate are attached to a pair of support plates by a bolt. Plural pins protruding toward the head substrate are provided in the support plate. A gap is formed between the head substrate and the support plate through the pins. The gap prevents heat of the both ends of the head substrate from transferring to the support plate, and contributes to uniform the temperature in the overall length of the head substrate.
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