US Patent 7333330 Electronic component chassis with isolated power supply cooling

An electronics chassis, such as a computer chassis including various active electronic components having various heat dissipation rates and operating tolerances. A power supply and various components are housed in an enclosure. A component cooling system causes a first fluid to flow through an area surrounding the electronic components to cool the electronic components through convection. A power supply cooling system causes a second fluid to flow through an area surrounding the power supply to cool the power supply through convection by drawing fluid from an area external of said enclosure and exhausting fluid to an area external of said enclosure. The second fluid is isolated from the first fluid within the enclosure.