Patent attributes
A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating the packaging substrate. A heatsink is formed using an injection molding process. The heatsink has a front surface for mating with a semiconductor chip and a leadframe assembly. The heatsink also has a back surface from which a plurality of fins extend. The leadframe assembly includes a leadframe having leadframe leads extending from opposing sides of the leadframe to a central area of the leadframe. A liquid crystal polymer is disposed in a ring-shaped pattern on the leadframe leads. The liquid crystal polymer is partially cured. The leadframe assembly is mounted on the front surface of the heatsink and the liquid crystal polymer is further cured to form a packaging assembly, which is then singulated into packaging substrates.
