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US Patent 7335983 Carbon nanotube micro-chimney and thermo siphon die-level cooling

Patent 7335983 was granted and assigned to Intel on February, 2008 by the United States Patent and Trademark Office.

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Patent abstract

A method, apparatus and system with a semiconductor package including a microchimney or thermosiphon using carbon nanotubes to modify the effective thermal conductivity of an integrated circuit die.

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