Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Woon-Wai Chan0
Chi Ming Wong0
Date of Patent
March 4, 2008
0Patent Application Number
111005850
Date Filed
April 7, 2005
0Patent Primary Examiner
Patent abstract
The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander formed on an elongated rod slidably mounted within a vertical tubular housing. An SMD chip may be safely fetched by pressing the rod on the top of the SMD with a continuous depressing motion until the fingers clasp the SMD chip safely therebetween. A soldering unit with a bifurcate soldering head located juxtaposed to the fingers is operative to solder the SMD chip to the printed circuit board while the SMD chip is safely held in place.
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