Patent attributes
A cleaning apparatus 1 includes a foup loading/unloading part 2 for mounting foups F each accommodating a plurality of wafers W at intervals of a constant pitch (normal pitch), a rotor 34 capable of holding the wafers W at half the normal pitch (half pitch), a wafer transporting device 11 for transporting the wafer E between the foup F and the rotor 34, wafer posture changing devices 20a, 20b, a wafer elevating mechanism 40, a motor 31 for rotating the rotor 34, an outer chamber 71a and an inner chamber 71b both accommodating the rotor 34, and cleaning liquid nozzles 53, 55 for supplying a cleaning liquid to the wafers W. The rotor 34 holds the wafers W at intervals of an optional pitch (every one holding pitch or every plural holding pitches) to carry out a cleaning operation. Consequently, it is possible to process substrates accommodated in two containers at one batch processing.
