Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kyeong Ku Lee0
Date of Patent
March 4, 2008
0Patent Application Number
112063390
Date Filed
August 18, 2005
0Patent Primary Examiner
Patent abstract
The present invention relates to a Dual Interface IC card including a top layer, a bottom layer, an antenna embedding layer between the top and bottom layers and an IC chip module embedded in an IC chip module embedding hole. The antenna embedding layer has a groove in a rectangular shape at its one side where elastic plates are embedded in both sides of the groove. The IC chip module is inserted by applying an adhesive onto the antenna embedding layer or using an adhesive tape. Thus, the IC chip module is easily installed and not detached to give a good connection and a long time use.
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