US Patent 7338292 Board-to-board electronic interface using hemi-ellipsoidal surface features

Patent 7338292 was granted and assigned to Agilent Technologies on March, 2008 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Agilent Technologies

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

73382920

Patent Inventor Names

Brock J. LaMeres0

Kenneth W Johnson0

Date of Patent

March 4, 2008

Patent Application Number

113400670

Date Filed

January 26, 2006

Patent Primary Examiner

‌

Chandrika Prasad

Patent abstract

A board-to-board interconnect is presented. The interconnect is fashioned from solder beads or hemi-ellipsoidal surface features on a surface of a printed circuit board and contact pads on a second printed circuit board.

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