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US Patent 7338905 Semiconductor device manufacture method

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7338905
Patent Inventor Names
Kenji Nakano0
Tamotsu Yamamoto0
Tetsuya Shirasu0
Toshiyuki Karasawa0
Nobuhiro Misawa0
Date of Patent
March 4, 2008
Patent Application Number
10838218
Date Filed
May 5, 2004
Patent Primary Examiner
‌
Alexander Ghyka
Patent abstract

An electric conductive film is formed on the insulating surface of a substrate, the substrate having a trench formed on the insulating surface, and the conductive film being filled in the trench. Chemical mechanical polishing is executed to expose the insulating surface of the substrate and leave a portion of the conductive film in the trench. The surface of the substrate having the exposed conductive film in the trench and the exposed insulating surface is exposed to first liquid. After being exposed to the first liquid, the surface of the substrate is exposed to second liquid. The first liquid is either solution which contains at least one first substance selected from a first group consisting of benzotriazole, derivative of benzotriazole and interfacial active agent, or water. The second solution is solution which contains the first substance at a density higher than a density of the first liquid.

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