Patent attributes
An SMD LED package with superior thermal dissipation capability is provided. The SMD LED package comprises a supporting block with circuit patterns and at least one LED attached to the supporting block. Wherein, circuit patterns of holes/vias, insulating layers, and conducting traces/pads are formed on and in the supporting block. The SMD LED packages can be further assembled to form a light module that allows emitted lights to travel in parallel with the mounting surface. The SMD manufacturing process is a mature production process and thus easy for mass production. Single or plural LED chips are mounted on a thermal conducting block that is disposed with patterns of conducting traces/pads and isolating dielectric layers. The side emitting characteristics of the present invention offers the advantage of reflecting and mixing the emitted lights to meet the desired chromaticity.
