Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jae Hun Ku0
Jeffrey D. Punzalan0
Jose Alvin Caparas0
Date of Patent
March 4, 2008
0Patent Application Number
113797400
Date Filed
April 21, 2006
0Patent Primary Examiner
Patent abstract
A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.
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