An apparatus is provided that includes a body having a first wall and a second wall, at least one appending structure extending from an end of the body and at least one actuator positioned between the first and second walls. The actuator includes first end coupled to a portion of the body and a second end coupled to a portion of the appending structure. At least one shape memory alloy (SMA) wire is connected to and extends between the first and second ends of the actuator. The SMA wire is adapted to controllably constrict when activated by heat, whereby the constriction causes the appending structure to move from a first position to a second position.