US Patent 7341909 Methods of forming semiconductor constructions
Patent 7341909 was granted and assigned to Micron Technology on March, 2008 by the United States Patent and Trademark Office.
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Patent abstract
The invention includes methods of forming semiconductor constructions in which electrically conductive structures are formed between bitlines to electrically connect with storage node contacts. The bitlines can be formed within trenches having faceted top portions. The invention also includes semiconductor structures containing trenches with faceted top portions, and containing bitlines within the trenches.
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US Patent 07341909 Methods of forming semiconductor constructions US Patent 7341909 Methods of forming semiconductor constructions
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Patent Number
0734190900
Patent Number
734190900
Edits on 25 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073419090
Date of Patent
March 11, 2008
0Patent Application Number
110999720
Date Filed
April 6, 2005
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073419090
Date of Patent
March 11, 2008
0Patent Application Number
110999720
Date Filed
April 6, 2005
0Official Website
Patent Primary Examiner
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US Patent 07341909 Methods of forming semiconductor constructions
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07341909
Date of patent
March 11, 2008
Patent application number
11099972
Date Filed
April 6, 2005
Patent primary examiner
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