A flexible printed circuit film that is capable of preventing a bonded pad from being separated or opened because of a force applied to a bonded part when the flexible printed circuit film is engaged to a printed circuit board. In the film, a first pad is provided at one end of a body to be adhesively connected to a second pad of a first printed circuit board. A third pad is provided at other end of the body to be engaged to a connecter of a second printed circuit board. At least one recess is defined in the body of the flexible printed circuit film. Accordingly, it becomes possible to prevent a contact portion between other pad of the FPC film and the pad of the data circuit board from being separated or opened due to a force applied upon engagement of one pad of the FPC film to the connecter of the timing control board.