Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Akiyoshi Saito0
Date of Patent
March 11, 2008
0Patent Application Number
111343630
Date Filed
May 23, 2005
0Patent Primary Examiner
Patent abstract
A printed board suitable for having a LSI surface-mounted thereto and improves high-speed transfer characteristic while maintaining the circumference of a pad formed on the printed board. The pad is a connector pad consisting of a conductor pattern, and the area of the conductor pattern forming the pad is smaller than an area determined based on the circumference of the conductor pattern that forms the pad.
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