Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Christopher J. Berry0
Christopher M. Scanlan0
Date of Patent
March 11, 2008
Patent Application Number
11364427
Date Filed
February 28, 2006
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device and method of manufacturing has a substrate having a plurality of metal layers. At least one metal layer is exposed on at least one side surface of the semiconductor device. A die is coupled to the substrate. A mold compound encapsulates the die and a top surface of the substrate. A conductive coating is applied to the mold compound and to at least one metal layer exposed on at least one side surface of the substrate.
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