Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 11, 2008
Patent Application Number
10841741
Date Filed
May 7, 2004
Patent Primary Examiner
Patent abstract
A multi-chip package includes a package substrate. First and second semiconductor die are formed on the package substrate. The first and the second semiconductor die are configured to communicate with each other via a high-speed serial communications protocol.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
