High frequency edge mount connector apparatus comprises a connector including a housing that forms an opening and a signal carrier in the housing allowing for low return loss and low insertion loss. The signal carrier has a pin which extends through the opening. The connector also includes an insulator in the housing and surrounding the signal carrier, wherein the insulator has a outer portion surrounding the pin and extending through the opening. By extending the insulator through the opening, a tight seal can be created when the connector is pressed against a circuit board. The seal allows for improved impedance matching for a signal traveling between the connector and the circuit board.