US Patent 7344917 Method for packaging a semiconductor device
Patent 7344917 was granted and assigned to Freescale Semiconductor on March, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
November 30, 2005
Date of Patent
March 18, 2008
Patent Application Number
11290300
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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