Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kinya Ichikawa0
Debendra Mallik0
Johanna Swan0
Terry L. Sterrett0
Date of Patent
March 18, 2008
0Patent Application Number
107283240
Date Filed
December 4, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit package. A first portion of the interconnect may be in contact with the mold compound, a second portion of the interconnect might not contact the mold compound, and a third portion of the interconnect may be in contact with the integrated circuit package.
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