US Patent 7347766 Cutting method and cutting apparatus
Patent 7347766 was granted and assigned to Disco Corporation on March, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Yuichi Shimizu0
Yuji Nitta0
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Patent abstract
The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade that does not ultrasonically vibrate. With such a method and apparatus, the crystal material portion and the amorphous material portion of the composite material can be cut cleanly without chipping.
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US Patent 07347766 Cutting method and cutting apparatus US Patent 7347766 Cutting method and cutting apparatus
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Patent Number
073477660
Patent Number
73477660
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Current Assignee
Patent Jurisdiction
Patent Number
073477660
Date of Patent
March 25, 2008
0Patent Application Number
115198000
Date Filed
September 13, 2006
0Official Website
Patent Primary Examiner
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US Patent 07347766 Cutting method and cutting apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07347766
Date of patent
March 25, 2008
Patent application number
11519800
Date Filed
September 13, 2006
Patent primary examiner
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