US Patent 7348272 Method of fabricating interconnect
Patent 7348272 was granted and assigned to United Microelectronics Corporation on March, 2008 by the United States Patent and Trademark Office.
Is a
Date Filed
August 3, 2005
0
Date of Patent
March 25, 2008
0
Patent Application Number
11161431
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Patent Inventor Names
Shu-Jen Sung
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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