Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 25, 2008
Patent Application Number
09848140
Date Filed
May 3, 2001
Patent Primary Examiner
Patent abstract
A metal-ceramic circuit board is characterized by being constituted by bonding directly on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member of an electronic circuit. The base plate has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1 mm.
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