US Patent 7348498 Partially voided anti-pads
All edits
Edits on 1 Sep, 2023
Golden AI
Edits made to:
Article (+246 characters)
Article
Patent abstract
A printed circuit board comprises a conductive layer and a via transecting the conductive layer. The printed circuit board comprises a pattern of conductive material having a plurality of voids in the conductive layer near the via.
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07348498 Partially voided anti-pads US Patent 7348498 Partially voided anti-pads
Infobox
Patent Number
0734849800
Patent Number
734849800
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 6 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073484980
Date of Patent
March 25, 2008
0Patent Application Number
106216610
Date Filed
July 17, 2003
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
073484980
Date of Patent
March 25, 2008
0Patent Application Number
106216610
Date Filed
July 17, 2003
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 24 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07348498 Partially voided anti-pads
Infobox
Is a
Patent jurisdiction
Patent number
07348498
Date of patent
March 25, 2008
Patent application number
10621661
Date Filed
July 17, 2003
Patent primary examiner
Find more entities like US Patent 7348498 Partially voided anti-pads
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
