US Patent 7348672 Interconnects with improved reliability
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Patent Inventor Names
Hsien-Wei Chen0
Hsueh-Chung Chen0
Shin-Puu Jeng0
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Patent abstract
An interconnect architecture with improved reliability. An interconnect with rounded top corners is inlaid in a dielectric layer. A filler borders the interconnect along the corners of the interconnect.
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US Patent 07348672 Interconnects with improved reliability US Patent 7348672 Interconnects with improved reliability
Infobox
Patent Number
073486720
Patent Number
73486720
Edits on 26 Sep, 2022
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Patent Jurisdiction
Patent Number
073486720
Date of Patent
March 25, 2008
0Patent Application Number
111753290
Date Filed
July 7, 2005
0Official Website
Patent Primary Examiner
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US Patent 07348672 Interconnects with improved reliability
Infobox
Is a
Patent jurisdiction
Patent number
07348672
Date of patent
March 25, 2008
Patent application number
11175329
Date Filed
July 7, 2005
Patent primary examiner
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