Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shinichi Hashimoto0
Date of Patent
March 25, 2008
0Patent Application Number
108372260
Date Filed
April 30, 2004
0Patent Primary Examiner
Patent abstract
The IC socket assembly includes the heat sink for abutting the upper surface of an IC package to dissipate heat generated thereby, and a fixing member for fixing the heat sink to the housing. The fixing member includes: a frame, mounted on a surface of the circuit board, on which the housing is mounted; a back plate, mounted on the opposite surface of the circuit board, having engaging arms, which are inserted through apertures of the circuit board and engage the frame; a pair of loading beams, fixed to the engaging arms; and a pair of levers, axially supported by the loading beams, for urging the heat sink toward the housing.
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