Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kenji Fukumoto0
Shinji Kanayama0
Shoriki Narita0
Takaharu Mae0
Hiroshi Wada0
Kazushi Higashi0
Koichi Yoshida0
Makoto Imanishi0
...
Date of Patent
April 1, 2008
0Patent Application Number
111140840
Date Filed
April 26, 2005
0Patent Primary Examiner
Patent abstract
A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).
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