US Patent 7351087 Land grid array package socket
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Patent Inventor Names
Ming-Lun Szu0
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Article (+416 characters)
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Patent abstract
Disclosed is an LGA socket (1) including a socket body (10) having a number of terminals (11) embedded therein. A stiffener (12) is bottomed to the socket body. A load plate (14) and a load lever (15) are pivotally assembled to two opposite ends of the stiffener. At least one of the stiffener and the load plate is formed to have a lateral-opened hollow frame by stamp of an elongated strip of metal.
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US Patent 07351087 Land grid array package socket US Patent 7351087 Land grid array package socket
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Patent Number
073510870
Patent Number
73510870
Golden AI
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Official Website
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Golden AI
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Patent Jurisdiction
Patent Number
073510870
Date of Patent
April 1, 2008
0Patent Application Number
112241820
Date Filed
September 12, 2005
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
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Edits on 24 Nov, 2021
Golden AI
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US Patent 07351087 Land grid array package socket
Infobox
Is a
Patent jurisdiction
Patent number
07351087
Date of patent
April 1, 2008
Patent application number
11224182
Date Filed
September 12, 2005
Patent primary examiner
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