US Patent 7351633 Method of fabricating semiconductor device using selective epitaxial growth

A method of fabricating a semiconductor device using selective epitaxial growth (SEG) is disclosed. The method comprises; forming a seed window exposing a portion of a substrate through an interlayer insulating layer, growing a single crystal silicon SEG layer in the seed window using the exposed portion of the substrate as a seed, depositing an amorphous silicon layer on the interlayer insulating layer and in contact with the SEG layer, and performing an annealing process on the amorphous silicon layer over an annealing interval, and during the annealing interval applying microwave energy to the amorphous silicon layer.