Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
April 1, 2008
Patent Application Number
10775966
Date Filed
February 9, 2004
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods and apparatus are provided for interconnecting primary components with secondary components on a programmable chip. Control, data, and address lines are automatically generated to connect primary components and secondary components with an interconnection module. The interconnection connection module manages interaction between primary components and secondary components and provides support for fixed latency and variable latency secondary components.
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