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US Patent 7354334 Reducing polishing pad deformation

Patent 7354334 was granted and assigned to Applied Materials on April, 2008 by the United States Patent and Trademark Office.

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Patent abstract

A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A vent path is provided with an opening to the cavity.

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