US Patent 7354488 Palladium alloy

A family of alloys for use in medical, electrical contact and jewelry applications includes as primary components palladium, and boron and at least one of ruthenium, rhenium, platinum, gold, zirconium, tungsten, cobalt, nickel, tantalum and iridium. An alternative embodiment includes palladium and rhenium and/or ruthenium with an additional element iridium, platinum, tungsten, boron, gold, zirconium, cobalt, nickel and tantalum. The present alloy family has a high strength, high radio opacity, and biocompatibility characteristics, while also being workable into various configurations. Where required, some of the alloys also offer post form, heat treatment (age hardening) capabilities for even higher hardness and strength levels.