US Patent 7358116 Substrate conductive post formation
Patent 7358116 was granted and assigned to Intel on April, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Boyd L. Coomer0
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Patent abstract
A substrate with at least one conductive post formed prior to the formation of an inter-layer dielectric (ILD) coating on the substrate. The conductive post may be formed from a metal layer of the substrate. Additionally, the conductive post may be built up on the substrate.
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US Patent 07358116 Substrate conductive post formation US Patent 7358116 Substrate conductive post formation
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Patent Number
073581160
Patent Number
73581160
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Patent Jurisdiction
Patent Number
073581160
Date of Patent
April 15, 2008
0Patent Application Number
101349510
Date Filed
April 29, 2002
0Official Website
Patent Primary Examiner
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US Patent 07358116 Substrate conductive post formation
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07358116
Date of patent
April 15, 2008
Patent application number
10134951
Date Filed
April 29, 2002
Patent primary examiner
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