Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masahiko Nakano0
Seiji Nagatani0
Takuya Yamamoto0
Date of Patent
April 15, 2008
0Patent Application Number
099257400
Date Filed
August 10, 2001
0Patent Citations Received
Patent Primary Examiner
Patent abstract
To reduce warping of a copper clad laminate coated with copper foils of different thicknesses on both sides, and thereby to improve production efficiency of the printed-wiring boards, there is provided a copper clad laminate coated with copper foils of different thicknesses on both sides, wherein a first copper foil on one side of the laminate is not recrystallizable by hot pressing for production of said laminate and a second foil on the other side is recrystallizable by the hot pressing and thicker than the first foil.
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