Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 15, 2008
Patent Application Number
11166606
Date Filed
June 23, 2005
Patent Primary Examiner
Patent abstract
Enhanced band bending materials for use in rectifying contacts comprising metal nanoparticles and a semiconducting polymer that is soluble in common organic solvents including, for example, a gold-polymeric nanocomposite comprising gold nanoparticles in poly(m-phenylenevinylene-co-2,5-dioctoxy-p-phenlenevinylene((“PmPV”). The nanocomposite material provides for enhanced Schottky barriers.
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