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US Patent 7358444 Folded substrate with interposer package for integrated circuit devices

Patent 7358444 was granted and assigned to Intel on April, 2008 by the United States Patent and Trademark Office.

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Patent abstract

In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.

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