US Patent 7358549 Multi-layered metal routing technique
Patent 7358549 was granted and assigned to Taiwan Semiconductor Manufacturing Company on April, 2008 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 24, 2006
Date of Patent
April 15, 2008
Patent Application Number
11338316
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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