Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Boon Keng Lok0
Chee Wai Lu0
Sunappan Vasudivan0
Date of Patent
April 15, 2008
0Patent Application Number
108880760
Date Filed
July 9, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A circuit board is formed by mounting at least one passive component on a first surface of a first laminate material; interconnecting the passive component to contact traces and vias of the first laminate material; and attaching a second laminate material to the first surface of the first laminate material utilizing a lamination process, the second laminate material sheet having at least one of a recess, a through-hole or both formed therein for accommodating the passive component in the second laminate.
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