US Patent 7362133 Three dimensional integrated circuits

In a first aspect, a three-dimensional semiconductor device, wherein: a configurable memory element coupled to a programmable logic circuit to program the logic circuit is positioned substantially above the logic circuit. In a second aspect, a three-dimensional semiconductor device, comprising: a first module layer having a circuit block; and a second module layer positioned substantially above the first module layer, comprising a configuration circuit coupled to the circuit block to program the circuit block.