Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yasuo Yamazaki0
Date of Patent
April 29, 2008
0Patent Application Number
112097220
Date Filed
August 24, 2005
0Patent Primary Examiner
Patent abstract
A method of manufacturing a semiconductor device. The device includes a plurality of layers on a semiconductor substrate. The method includes the steps of dividing a pattern of at least one layer into a plurality of sub-patterns, and joining the divided sub-patterns to perform patterning. A layer that includes wiring substantially affects operation of the semiconductor device depending on a positional relationship to any other wiring. The patterning is performed by one-shot exposure using a single mask.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.