US Patent 7365419 Surface-mount packaging for chip
Patent 7365419 was granted and assigned to Hon Hai Precision Industry Co Ltd on April, 2008 by the United States Patent and Trademark Office.
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Patent Inventor Names
Ming-Chih Hsieh0
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Article (+284 characters)
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Patent abstract
A chip includes a plurality of pins; and a plurality of symbols defined on a surface of the chip, wherein the symbols are arranged as a graduated scale corresponding with the pins. It becomes very easy to find a initial pin from among the plurality of pins of the chip.
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US Patent 07365419 Surface-mount packaging for chip US Patent 7365419 Surface-mount packaging for chip
Infobox
Patent Number
073654190
Patent Number
73654190
Edits on 2 Apr, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
073654190
Date of Patent
April 29, 2008
0Patent Application Number
113095400
Date Filed
August 18, 2006
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
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Edits on 26 Nov, 2021
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US Patent 07365419 Surface-mount packaging for chip
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07365419
Date of patent
April 29, 2008
Patent application number
11309540
Date Filed
August 18, 2006
Patent primary examiner
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