US Patent 7365442 Encapsulation of thin-film electronic devices

One embodiment of this invention pertains to multiple encapsulated thin-film electronic devices. These encapsulated devices include a substrate and multiple thin-film electronic devices are on this substrate. Each of the multiple thin-film electronic devices has an active area. The encapsulated devices also include an encapsulation layer that is on the substrate and this encapsulation layer has multiple holes and these multiple holes are over the active areas of the multiple thin-film electronic devices. The encapsulated devices also include multiple substantially flat encapsulation pieces that are on the encapsulation layer and these multiple substantially flat encapsulation pieces cover the multiple holes of the encapsulation layer. An absorbent material is not attached to any of the substantially flat encapsulation pieces.