Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Young-Min Lee0
Date of Patent
April 29, 2008
Patent Application Number
11618954
Date Filed
January 2, 2007
Patent Primary Examiner
Patent abstract
An electronic circuit package includes a first electronic module, a second electronic module, and an electric shielding layer. The first electronic module and the second electronic module are bonded in such a way that integrated devices are opposite to each other. The electric shielding layer is inserted between the first electronic module and the second electronic module for ensuring electric insulation between the first electronic module and the second electronic module.
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